Ceramic Resin - Engineering Ceramic Rigid+
$225.00 USD
Sale price
$225.00 USD
Regular price
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Ceramic Resin - Engineering Ceramic Rigid+
$225.00 USD
Sale price
$225.00 USD
Regular price
RESTOCKING FIRST WEEK OF SEPTEMBER 2026
Engineering Ceramic Rigid+
50%+ Ceramic-Filled 405nm 3D Printer Resin, High-Temp Injection Mold Tooling & Prototyping Resin, Cream, 1KG/L
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Exceptional Heat Resistance — 278°C Heat Deflection Temperature (HDT @ 0.45 MPa) makes this resin suitable for high-temperature environments including injection mold tooling and inserts
- 50%+ Ceramic Loading — High ceramic content delivers outstanding dimensional stability and a smooth, porcelain-like finish after heat post-processing
- Serious Mechanical Strength — 1500 MPa Elastic Modulus, 4895 MPa Flexural Modulus, and 85D Shore Hardness for durable, production-capable parts
- 405nm LCD/DLP Compatible — Formulated for standard 405nm resin printers with efficient, rapid production cycles
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Made in the USA — Formulated and bottled in the United States
Compatibility
405nm LCD/DLP compatible. Validated print settings available on request (tested at 50µm layer height, 1.6s exposure per layer on a 9K-class 405nm LCD printer).
Product Description
Applied Molecules Engineering Ceramic Rigid+ is a high-performance, ceramic-filled 405nm photopolymer engineered for demanding, high-temperature applications. With over 50% ceramic loading and a 278°C heat deflection temperature, it's built for environments where dimensional stability under heat is critical — including injection mold tooling, inserts, and fixtures that need to survive repeated hot-plastic injection cycles without deforming. Prints start out white and develop a natural, raw porcelain-like appearance after heat post-processing, echoing the material's real ceramic content. Backed by strong mechanical properties — 1500 MPa elastic modulus, 4895 MPa flexural modulus, and 85D Shore hardness — this resin holds up for both prototyping and end-use production runs, and can be customized to meet specific application requirements.
Print & Cure Procedure
Tested printed directly to the build plate on a 405nm LCD printer (9K-class) at 50µm layer heights, 1.6s exposure per layer. Samples were washed alternately in Applied Molecules Solution 27 (a water-based wash solution) at 75°C with an air spray until fully clean, then post-cured for 10 minutes at 365nm and 50°C. For improved whitening, extended heating at >60°C is recommended.